UMS Holdings

[orangetea]

CEO Andy's deemed shares has been transferred from:

Raffles Nominees Pte Ltd to UOB Kay Hian Pte Ltd.

So now whenever we see UOB Kay Hian, we know its Andy's portion of the company.

[Jacmar]

CEO Andy's deemed shares has been transferred from:

Raffles Nominees Pte Ltd to UOB Kay Hian Pte Ltd.

So now whenever we see UOB Kay Hian, we know its Andy's portion of the company.

I think this is faulty conclusion. If I buy my shares under UOB KH nominees it would be pooled together with his and many others bought through UOB Kay Hian. For the record I happen to own a UOB KH nominees account

[specuvestor]

Hi are margined shares held under the same entity UOB KH nominee or another entity?

[orangetea]

I think this is faulty conclusion. If I buy my shares under UOB KH nominees it would be pooled together with his and many others bought through UOB Kay Hian. For the record I happen to own a UOB KH nominees account

I don't agree why shares that investors buy under UOB KH should be pooled under his.

It must be clearly separated.

[orangetea]

Hi are margined shares held under the same entity UOB KH nominee or another entity?

I believe UOB KH managed ones can be lent to do shorting.

[specuvestor]

I think this is faulty conclusion. If I buy my shares under UOB KH nominees it would be pooled together with his and many others bought through UOB Kay Hian. For the record I happen to own a UOB KH nominees account

I don't agree why shares that investors buy under UOB KH should be pooled under his.

It must be clearly separated.

It's segregated account under same entity. So reporting wise u only see the entity

U probably dont understand my question either but thanks

[Boon]

Cover Story: Beyond the Smartphone: The Next Big Thing

David Lammers

The semiconductor industry has been on a roll, pushing well past $300 billion in annual revenues. But with smartphones and tablets showing signs of slowing down, the industry’s perennial question returns: What is the next big thing?

Lacking a clear consensus on specifics, most market watchers nonetheless agree that it will have something to do with the Internet of Things (IoT). A June 2014 report by International Data Corporation (IDC) estimates that sales of billions of smart, connected gadgets like Google Glass will generate a stunning $7.1 trillion in annual sales by 2020, with most of the total in services and supporting software.

According to Rob Lineback, an analyst at IC Insights, some people in the industry are looking for one or two huge growth drivers; others believe the next big thing will be made up of many products to serve many markets........................................................................

........................................................................................

Printed Electronics Needed?

Rosa said he believes silicon-based solutions will not be inexpensive enough to meet the cost targets mandated by many IoT applications. Printed electronics on cheap plastic substrates will finally come to the fore, undercutting the cost to process silicon wafers. While some market research firms predict that a trillion sensors will be in use by 2020 or 2022, Rosa said that is unlikely unless production costs are driven down. “There are about 12–14 billion MEMS in use today, so a trillion sensors by 2020 is not going to happen unless we can cut the manufacturing costs by one to two orders of magnitude.”

Dean Freeman, semiconductor manufacturing analyst at Gartner, said printed electronics are appealing, but thus far they haven’t found a commercial high-volume application. “Many of the IoT-class MCUs and communications devices will be made in 300mm fabs, using legacy process technology.”

Freeman calculates that 10 billion IoT things, each with an average of three MEMs devices, may be made in 2020. That would create demand for about 22 new or converted 200mm fabs, each running 50k wafers per month. “That is assuming an 80% yield and a 4mm2 device. That is about 1.1 to 1.2 million wafer starts per month,” he said. Viewed another way, a moderately successful IoT market would add about 10% to the annual wafer fab equipment (WFE) expenditures, about equal to today’s market for refurbished equipment, he added.

The Next Big Thing: IoT or I Don’t Know?

So all of this debate leaves us with a few questions: Will the next big thing rely more on chip technology, new materials technology, or software? Or all of the above? And at the end of the day, what is it that will have us lining up at some big-box store at midnight to buy one?

Applied Ventures’ Tanghal, who considers herself an optimist, firmly believes that something will emerge as a high-volume, high-value product akin to what the smartphone has been since 2007. The next big thing is out there, she said, probably being developed by young people in ambitious startups with dreams of a buy-out by companies like Google, Amazon, or others. Maybe personal robots, drones or other forms of human assistance systems will be winners. Or something else?

“Innovation doesn’t stop,” said Tanghal.

http://www.appliedmaterials.com/nanochip...-big-thing

(vested)

[Boon]

Still going strong.

Monthly figures for both billing and booking for each of the first 6 months of 2014 were higher than the corresponding monthly figures last year.

Quarterly figures for both billings and bookings for 2Q2014 were higher than 1Q2014.

June 2014 bookings are at the highest level since May 2012 - Could this strong momentum continue through to 2H, bearing in mind that 2H is normally weaker than 1H ? Well, have to wait and see !

(vested)
________________________________________________________________________________________________________________

North American Semiconductor Equipment Industry Posts June 2014 Book-to-Bill Ratio of 1.09

SAN JOSE, Calif. — July 21, 2014 — North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 1.09 means that $109 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in June 2014 was $1.47 billion. The bookings figure is 4.3 percent higher than the final May 2014 level of $1.41 billion, and is 10.0 percent higher than the June 2013 order level of $1.33 billion.

The three-month average of worldwide billings in June 2014 was $1.34 billion. The billings figure is 4.8 percent lower than the final May 2014 level of $1.41 billion, and is 10.4 percent higher than the June 2013 billings level of $1.21 billion.

“Semiconductor equipment bookings are at the highest level since May 2012,” said Denny McGuirk, president and CEO of SEMI. “The strength of the June bookings (three-month average) substantiate the outlook for strong double-digit sales growth this year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.


Billings (3-mo. avg)
Bookings (3-mo. avg)
Book-to-Bill

January 2014
1,233.2 ( 27.0% HIGHER than January 2013 billing of USD 0.968 billion )
1,280.3 ( 19.0% HIGHER than January 2013 booking of USD 1.08 billion )
1.04

February 2014
1,288.3 (32% HIGHER than February 2013 billing of USD 0.9747 billion )
1,295.4 (21.0% HIGHER than February 2013 booking of USD 1.07 billion )
1.01

March 2014
1,225.5 (23.7% HIGHER than March 2013 billing of USD 0.991 billion)
1,297.7 (18% HIGHER than March 2013 booking of USD 1.10 billion)
1.06

April (2014)
1,403.2 (28.7% HIGHER than April 2013 billing of USD 1.09 billion)
1,443.0 (23.3% HIGHER than April 2013 booking of USD 1.17 billion)
1.03

May 2014 (Final)
1,407.8 (15.4% HIGHER than May 2013 billing of USD 1.22 billion)
1,407.0 ( 6.6% HIGHER than May 2013 booking of USD 1.32 billion)
1.00

June 2014 (prelim)
1,340.4 (10.4% HIGHER than June 2013 billing of USD 1.21 billion)
1,467.1 ( 10.0% HIGHER than June 2013 booking of USD 1.33 billion)
1.09

http://www.semi.org/en/node/50651?id=highlights

[Boon]

Singapore invests $200m in semiconductor R&D

23 July 2014

Faster and cheaper commercialisation of semiconductor technologies will be achieved with the launch of four new labs in Singapore.

That is the opinion of Professor Dim-Lee Kwong, executive director of the Institute of Microelectronics (IME), who said: "These collaborations will encourage semiconductor R&D that is relevant for industry, and provide solutions for a rapidly evolving global electronics market."

IME is a research institute within the Singapore government's Agency for Science, Technology and Research (A*STAR). The four labs, which will come at a cost of around S$200m (£95m), are a joint venture between IME and ten industry partners: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron Ltd. and Tokyo Ohka Kogyo.

Professor Kwong continued: "Through this integrated platform, our partners can leverage A*STAR IME's technologies and expertise to develop innovative technologies and products to address challenges in the semiconductor industry." ....................................................

http://www.newelectronics.co.uk/electron...-rd/62732/

(vested)

[Boon]

This is the sales revenue of Endura - the first and only piece of information of its kind I have come across so far.

At first glance, the 2010 to 2013 figures look highly correlated to semicon revenue of UMS - it would be interesting to explore further on this.

Wow, the 2000 sales revenue (roughly of USD 1.9 billion) would be hard to beat !

(vested)

Applied Materials ENDURA sales history

[Image: 121z79h.jpg]

http://www.wesrch.com/wiki-3908-applied-...es-history