Malaysia Economic News

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Malaysia's Meltdown Moment - The INSIDE STORY
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With the new Agong having some interest in the HSR to pass through Forest City, the local business community is actually making a very good bet by submitting proposals (that require gov support) VS what the RFI (private funding only) is asking for. A game changer for the local construction industry if somehow the current gov yields.

New bids in to revive KL-Singapore high-speed rail, but govt funding remains missing link

It was reported that Japanese companies including East Japan Railway Company pulled out from the project just days before the Jan 15 deadline, describing it as “too risky” without the government’s financial support.

In a stock exchange filing on Jan 26, Berjaya Land announced that its 70 per cent-owned subsidiary Berjaya Rail (B-Rail) had formed a consortium with IJM Construction, Malaysian Resources Corp and Malaysia’s national railway firm Keretapi Tanah Melayu to submit a bid for the HSR.

ST has also learnt that YTL Corp, which in 2018 was appointed to be a project delivery partner to design and deliver civil works for the HSR before it was suspended, has put in a fresh bid for the project.

A highly placed source in YTL said the company has asked for some form of government financial support in its bid, to manage the mounting costs of building the line.

AmInvestment Bank analyst Alex Goh said no rail projects in Asia have got off the ground without government funding.
Investors normally focus on sexy part of semiconductor - frontend and leading edges. Not saying these ain't profitable, but what is been less looked at, like backend, may actually be better investment candidates.

For example, MMH listed on SGX, has >20% NPM (before the current downturn) and mainly supplies consumables to backend. And, their NPMs are not boosted by another share of results of associates/JV.

Chipmakers searching for ‘China plus 1’ are finding Malaysia

Malaysia’s track record has been mostly in the back end of the semiconductor supply chain – which includes packing, assembling and testing components – activities that traditionally have been considered less complex and of lower value.

But now the industry’s focus on packaging smaller chips – chiplets – more tightly together to increase computing power is increasing the value and technical complexity of those activities.

Intel is building its first overseas facility for advanced 3D chip packaging in Malaysia. When you bring in cutting-edge technology there is a “ripple effect”, said AK Chong, a vice-president and managing director of Intel in Malaysia. That development will attract dozens of new businesses and help advance the labour force’s entire skill set.

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