UMS Holdings

[Boon]

Good to see the introduction of another innovative product from AMAT with breakthrough technology on the Endura - PVD platform......more sales of Endura systems means more job for UMS..........

______________________________________________________________________________________________________________________________

APPLIED MATERIALS' BREAKTHROUGH PATTERNING HARDMASK ENABLES COPPER INTERCONNECT SCALING

New hardmask technology is essential for patterning closely spaced, thin interconnects to 10nm and beyond
Underscores PVD leadership with system now tool of record for multiple device generations at leading chipmakers


SANTA CLARA, Calif., May 19, 2015 - Applied Materials, Inc. today announced its Applied Endura® Cirrus™ HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips............................................

http://www.appliedmaterials.com/company/...ct-scaling
____________________________________________________________________________________________________________________________________

APPLIED ENDURA® CIRRUS™ HTX PVD

Revolutionizing physical vapor deposition (PVD) technology for titanium nitride (TiN) thin films, the Endura Cirrus HTX TiN solves hardmask extendibility challenges for next-generation devices. As chip features continue shrinking, innovations in hardmask are crucial for accurately patterning ever more complex, tiny interconnect structures. Leveraging years of expertise in PVD, the new system produces a breakthrough hardmask that ensures pattern fidelity beyond the 10nm node.

As chip designs advance, features are becoming progressively smaller with higher aspect ratios and are being packed more densely in creating advanced integrated circuits. Consequently, the robustness of materials used to define the patterns etched and metallized to create the circuitry (or interconnects) is vitally important in preserving the integrity of those patterns. The slightest flaw can make it impossible to properly metallize the device, rendering it unreliable or non-functional....................

http://www.appliedmaterials.com/products...us-htx-pvd